发明公开
- 专利标题: High density interconnect apparatus for an ink-jet printhead
- 专利标题(中): 用于喷墨打印头的高密度互连装置。
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申请号: EP94301186.6申请日: 1994-02-18
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公开(公告)号: EP0611653A3公开(公告)日: 1994-09-14
- 发明人: Stortz, James L.
- 申请人: Compaq Computer Corporation
- 申请人地址: 20555 S.H. 249 Houston Texas 77070 US
- 专利权人: Compaq Computer Corporation
- 当前专利权人: Compaq Computer Corporation
- 当前专利权人地址: 20555 S.H. 249 Houston Texas 77070 US
- 代理机构: Brunner, Michael John
- 优先权: US20050 19930219
- 主分类号: B41J2/14
- IPC分类号: B41J2/14
摘要:
The body of a piezoelectrically operable ink jet printhead (12) is mounted in an upper side surface groove (48) formed in a mounting plate member (14). A rear bottom section (26) of the printhead body has an exposed top side surface portion (30) which is flush with the top side (44) of the mounting plate member and terminates forwardly of its rear end (42). A high density parallel array of mutually spaced linear conductive traces (52) is formed on this exposed top side surface portion, the traces being used to transmit electrical operating signals from a separate electronic driver to piezoelectrically drivable channel sidewall sections (36) within the interior of the printhead body. A multitiered printed circuit board (16) secured to the top side of the mounting plate member is used to connect the printhead to the electronic driver. The circuit board has a series of linear traces (52a) formed on its bottom side which register with and are soldered to the closely spaced printhead body traces (52), a spaced series of lower density spacing contact pads (54a) formed on its top side and releasably engageable with correspondingly spaced contact pads on the electronic driver, and internal crossover circuitry (62) that operatively connects the high density underside linear traces of the circuit board to its lower density top side contact pads.
公开/授权文献
- EP0611653B1 High density interconnect apparatus for an ink-jet printhead 公开/授权日:1997-04-23
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