发明公开
EP0618617A2 Process for metallized vias in polyimide
失效
Polyimid的Herstellungsverfahren von metallisiertenDürchführungen
- 专利标题： Process for metallized vias in polyimide
- 专利标题（中）： Polyimid的Herstellungsverfahren von metallisiertenDürchführungen
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申请号： EP94103266.6申请日： 1994-03-04
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公开(公告)号： EP0618617A2公开(公告)日： 1994-10-05
- 发明人: O'Connor, Loretta Jean , Previti-Kelly, Rosemary Ann , Reen, Thomas Joseph
- 申请人： International Business Machines Corporation
- 申请人地址： Old Orchard Road Armonk, N.Y. 10504 US
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： Old Orchard Road Armonk, N.Y. 10504 US
- 代理机构： Schäfer, Wolfgang, Dipl.-Ing.
- 优先权： US38407 19930329
- 主分类号： H01L21/90
- IPC分类号： H01L21/90
摘要：
The process includes depositing a polyimide precursor (1), then a silane (2) and finally a metal (4), after patterning the polyimide (1) and silane (2). The sandwich is heated to completely imidize the polyimide (1), crosslink the silane (2) and anneal the metal (4) simultaneously. The excess metal (4) overlying the polyimide (1) between the vias (3) is removed by chemical mechanical polishing using the crosslinked silane (2) as a polish stop.
公开/授权文献
- EP0618617B1 Process for metallized vias in polyimide 公开/授权日：2004-05-12
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