A curable resin composition is disclosed which is composed of (a) an oxyalkylene polymer containing at least one reactive silicon group per molecule and having a number average molecular weight of not less than 3000 and an Mw/Mn ratio of not higher than 1.6, (b) a copolymer having a molecular chain which comprises (A) an alkyl acrylate monomer unit and/or an alkyl methacrylate monomer unit each having 1 to 8 carbon atoms in the alkyl moiety thereof and (B) an alkyl acrylate monomer unit and/or an alkyl methacrylate monomer unit each having 10 or more carbon atoms wherein the total number of monomer units (A) and monomer units (B) constitutes more than 50% of the monomer units in the copolymer (b), and (c) a curing catalyst.