发明公开
- 专利标题: APPARATUS FOR APPLYING SEAMLESS FLOORING MATERIAL
- 专利标题(中): 设备的无缝铺设地板
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申请号: EP94922742.0申请日: 1994-07-26
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公开(公告)号: EP0713551A1公开(公告)日: 1996-05-29
- 发明人: McKIM, Alan, M.
- 申请人: LEEMAC INDUSTRIES, INC.
- 申请人地址: 2018 Indian Boundary Road Melrose Park, IL 60160 US
- 专利权人: LEEMAC INDUSTRIES, INC.
- 当前专利权人: LEEMAC INDUSTRIES, INC.
- 当前专利权人地址: 2018 Indian Boundary Road Melrose Park, IL 60160 US
- 代理机构: Jackson, Richard Eric, et al
- 优先权: US19930097369 19930726
- 国际公布: WO1995003452 19950202
- 主分类号: E01C19
- IPC分类号: E01C19 ; B62D7 ; B62D9 ; E04F21
摘要:
An applicator (10) for applying seamless flooring material to a subfloor (11) including a chassis (12) steerably mounted on wheels (14, 16, 18). A dispensing hopper (28) on a frame (30) is towed behind the chassis (12) from a shaft (74, 76) on a steering column (72) and enabled to move in three dimensions independent of the chassis (12). The hopper (28) is supported by hopper wheels (296, 298) with the flooring material dispensed out of the hopper (28). The height of each side of the hopper (28) is independently adjustable on each side by screw-threaded rods (302, 304) and is not disrupted by lifting the hopper (28) out of operation.
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