发明公开
- 专利标题： Method and apparatus of testing an integrated circuit device
- 专利标题（中）： 用于测试集成电路装置的方法和设备
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申请号： EP96304121.5申请日： 1996-06-05
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公开(公告)号： EP0747717A3公开(公告)日： 1997-05-21
- 发明人: Hendricks, Matthew C. , Allen, Ernest III
- 申请人： ALTERA CORPORATION
- 申请人地址： 2610 Orchard Parkway San Jose, California 95035 US
- 专利权人： ALTERA CORPORATION
- 当前专利权人： ALTERA CORPORATION
- 当前专利权人地址： 2610 Orchard Parkway San Jose, California 95035 US
- 代理机构： Cross, Rupert Edward Blount
- 优先权： US481744 19950607
- 主分类号： G01R31/316
- IPC分类号： G01R31/316 ; H01L21/66
摘要：
A method and apparatus for testing an integrated circuit device. An integrated circuit device undergoes testing in at least two different stages of the manufacturing process. At one stage, the semiconductor wafer containing multiple chip dice is probed by a probe tester that tests each of the dice individually. At another stage, after an individual chip die has been encapsulated in a package, a package tester tests and exercises the functions of the chip.
公开/授权文献
- EP0747717A2 Method and apparatus of testing an integrated circuit device 公开/授权日：1996-12-11
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