A communications connector sub-assembly comprises a body defining a plurality of parallel grooves each receiving a jack contact. The body includes one or more insulation displacement connectors which have insulation displacement contacts anchored therein. The insulation displacement contacts are connected to the jack contacts through a printed circuit board. The anchoring of the insulation displacement contacts in the body secures the PCB to the body to give a complete sub-assembly. Side walls are provided to surround and protect free ends of the jack contacts from mechanical damage.