发明公开
EP0770434A3 Method of bonding metal plates, apparatus therefor and hot strip mill
失效
用于接合金属板和热轧带材轧机的方法和装置
- 专利标题： Method of bonding metal plates, apparatus therefor and hot strip mill
- 专利标题（中）： 用于接合金属板和热轧带材轧机的方法和装置
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申请号： EP96117156.8申请日： 1996-10-25
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公开(公告)号： EP0770434A3公开(公告)日： 1997-10-29
- 发明人: Funamoto, Takao , Nagakubo, Gen , Mashiko, Takashi , Ishikawa, Fuminori , Nishino, Tadashi , Yoshimura, Yasutsugu , Kajiwara, Toshiyuki , Yasuda, Kenichi , Nihei, Mitsuo , Takakura, Yoshio , Shimogama, Hironori
- 申请人： HITACHI, LTD.
- 申请人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 专利权人： HITACHI, LTD.
- 当前专利权人： HITACHI, LTD.
- 当前专利权人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 代理机构： Beetz & Partner Patentanwälte
- 优先权： JP280116/95 19951027
- 主分类号： B21B15/00
- IPC分类号： B21B15/00 ; B23K20/02
摘要：
A bonding apparatus (5) for bonding metal plates, comprises an overlapping mechanism (3) overlapping portions to be bonded of the metal plates (1,2), at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade (8) disposed at an opposite position of the supports so as to sandwich the overlapped portion of the metal plates, wherein a moving mechanism is provided for moving relatively at least one of the shearing blade and the supports so as to sandwich the overlapped portion of the metal plates (1,2) between the supports and the shearing blade (8). A method for bonding is characterized by bonding metal plated by using the above apparatus (5).
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