发明公开
- 专利标题： Polishing slurry
- 专利标题（中）： 抛光浆液
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申请号： EP96118201.1申请日： 1996-11-13
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公开(公告)号： EP0773269A2公开(公告)日： 1997-05-14
- 发明人: Miyashita, Naoto , Abe, Masahiro , Shimomura, Mariko
- 申请人： KABUSHIKI KAISHA TOSHIBA
- 申请人地址： 72, Horikawa-cho, Saiwai-ku Kawasaki-shi JP
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： 72, Horikawa-cho, Saiwai-ku Kawasaki-shi JP
- 代理机构： Hansen, Bernd, Dr. Dipl.-Chem.
- 优先权： JP317054/95 19951113; JP110575/96 19960408
- 主分类号： C09G1/02
- IPC分类号： C09G1/02 ; H01L21/306
摘要：
A polishing slurry for use in chemical mechanical polishing is disclosed. The polishing slurry contains a solvent and polishing particles dispersed in this solvent. The polishing particles are selected from silicon nitride, silicon carbide, and graphite. The primary particle size of the polishing particles dispersed in the solvent is appropriately 0.01 to 1000 nm. When the polishing particles are colloidally dispersed in the solvent, the secondary particle size of the polishing particles is appropriately 60 to 300 nm.
公开/授权文献
- EP0773269B1 Polishing slurry 公开/授权日：2002-02-13
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