A resist removing apparatus for removing unnecessary resist patterns from articles such as semiconductor substrates efficiently by using adhesive tape. A tape applicator unit is movable horizontally to apply the adhesive tape in strip form to a wafer supported on an applicator table. Then, a set of the tape applicator unit and a tape separator unit and a set of the applicator table and a separator table are moved horizontally relative to each other to shift the separator table under the wafer supported through the adhesive tape. A next wafer is transported to and placed on the applicator table in an unloaded state. The tape applicator unit and tape separator unit are moved horizontally and simultaneously to apply the adhesive tape to the wafer on the applicator table and separate the adhesive tape from the wafer on the separator table at the same time.