发明公开
- 专利标题： A mold of a photocured resin containing a reinforcing agent
- 专利标题（中）： 模具，其由光固化树脂与增强填料
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申请号： EP96114724.6申请日： 1996-09-13
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公开(公告)号： EP0781639A3公开(公告)日： 1999-02-10
- 发明人: Ueno, Takakuni, Tokyo Res Ctr of Teijin, Seiko Co , Tamura, Yorikazu, Tokyo Res Ctr of Teijin, Seiko C
- 申请人： Teijin Seiki Co., Ltd.
- 申请人地址： 1-go, 9-ban, Edobori 1-chome, Nishi-ku Osaka-shi, Osaka-fu JP
- 专利权人： Teijin Seiki Co., Ltd.
- 当前专利权人： Teijin Seiki Co., Ltd.
- 当前专利权人地址： 1-go, 9-ban, Edobori 1-chome, Nishi-ku Osaka-shi, Osaka-fu JP
- 代理机构： Weisert, Annekäte, Dipl.-Ing. Dr.-Ing.
- 优先权： JP339028/95 19951226
- 主分类号： B29C33/40
- IPC分类号： B29C33/40 ; B29C33/56 ; B29C70/02
摘要：
A mold having a cavity for shaping a three-dimensional object, which comprises a photocured resin of a photocurable resin composition comprising
(A) a liquid photocurable resin, and (B) at least one reinforcing agent selected from the group consisting of inorganic solid particles having an average particle diameter of 3 to 70 µm and a whisker having an average diameter of 0.3 to 1.0 µm, a length of 10 to 70 µm and an aspect ratio of 10 to 100 and optionally, in which the inner surface of the cavity is covered by a solid film having a thickness of 5 to 1000 µm.
(A) a liquid photocurable resin, and (B) at least one reinforcing agent selected from the group consisting of inorganic solid particles having an average particle diameter of 3 to 70 µm and a whisker having an average diameter of 0.3 to 1.0 µm, a length of 10 to 70 µm and an aspect ratio of 10 to 100 and optionally, in which the inner surface of the cavity is covered by a solid film having a thickness of 5 to 1000 µm.
公开/授权文献
- EP0781639B1 A mold of a photocured resin containing a reinforcing agent 公开/授权日：2003-03-26
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