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发明公开
EP0801424A2 Semiconductor device and assembling method thereof 失效
Halbleiteranordnung und Verfahren zum Zusammensetzen derselben

Semiconductor device and assembling method thereof
摘要：
A resin mold type semiconductor device (10) which can be prevented from occurring a crack and can be made thinner, is provided. A resin mold type semiconductor device comprises a semiconductor chip (11), a lead member (12) arranged in a manner that one side face (12a) of a head portion thereof touches a surface (11a) of the semiconductor chip, a wire (13) for electrically connecting the surface of the semiconductor chip and another side face of the lead member, an adhesive member (15) for adhering the one side face of the lead member and a peripheral face (11b) of the semiconductor chip, and a package (14) for molding the semiconductor chip, a part of the lead, the wire and the adhesive member by synthetic resin. In a further embodiment, the lead member is provided with a concave portion and in the one side face a groove extending from the concave portion to an end of the lead.
摘要（中）：

提供一种树脂模制型半导体装置（10），其能够防止发生裂纹并且可以变得更薄。 一种树脂模具型半导体器件，包括半导体芯片（11），引线构件（12），其引导部件（12）的头部的一个侧面（12a）接触半导体芯片的表面（11a），线（ 13），用于将所述半导体芯片的表面与所述引线构件的另一个侧面电连接，用于粘合所述引线构件的一个侧面和所述半导体芯片的外围面（11b）的粘合构件（15），以及 封装（14），用于通过合成树脂模制半导体芯片，引线，导线和粘合构件的一部分。 在另一实施例中，引线构件设置有凹部，并且在一个侧面中是从凹部延伸到引线的端部的凹槽。

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