A system for temperature control of an electronic component includes a heat plate (10) supporting the component (18); a heat plate temperature sensor (20), a fan (14) capable of providing air for cooling the heat plate; and a fan control (22) for using the heat plate temperature to control the operation of the fan to provide a substantially constant heat plate temperature. The system can further include a heat pipe assembly (12) having fins and coupled to the heat plate with the fan capable of providing air to the fins. The heat pipe assembly can include at least two heat pipes each having first ends coupled to the heat plate and second ends situated in a condensation section where at least one of the heat pipes has a different working fluid than an other. A switch temperature or load current sensor can be coupled to the heat plate and supply data to a switch controller for receiving the switch temperature, determining whether the temperature or load current has changed, and adjusting a switching frequency of the at least one electronic switch device in response to any change of the switch temperature. A bus layer can be situated adjacent the component and selectively coated with an insulating material and studs can mechanically and electrically coupling the bus layer and a printed circuit board to the component. An insulating shield can be situated between the bus layer and the printed circuit board with the studs.