A lapping surface plate consisting of an Fe-base material containing 0.8 to 3.5 wt% of C, 1 to 7 wt% of Si, 5 to 15 wt% of Ni, and 1 wt% or less of Mn, the balance substantially being Fe, further containing 0.1 wt% or less of at least one element selected from the group consisting of Mg, Ca, and Ce, and having a graphite structure and a hardness of 250 Hv or more.
Such a plate can be produced without quenching or rapid cooling to provide better accuracy and longer life in lapping operations upon e.g. semiconductor substrates.