Apparatus having a substrate having a planar conductive plating located on a first surface of a dielectric layer and having a conductive trace (a collection trace) located on a second surface of the dielectric layer such that the conducting plating and the conductive trace have a parallel, spaced-apart relation. The conductive trace is charged by supplying a voltage to the plating and the trace to establish a voltage differential across the dielectric layer. As such, depending upon the magnitude of the voltage, polarity of the voltage and the duration for which the voltage is applied to the trace, a certain quantity and polarity of charge accumulates on the trace. The material to be deposited is charged to an opposite polarity than that of the trace and then the deposition material is applied to the trace. Consequently, the substrate electrostatically retains the deposition material on the collection trace.