发明公开
EP0842966A2 Polymaleimide resin composition and laminate plate for semiconductor substrate using it
失效
聚马来酰亚胺树脂和层压板与此使用的半导体衬底
- 专利标题： Polymaleimide resin composition and laminate plate for semiconductor substrate using it
- 专利标题（中）： 聚马来酰亚胺树脂和层压板与此使用的半导体衬底
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申请号： EP97309134.1申请日： 1997-11-13
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公开(公告)号： EP0842966A2公开(公告)日： 1998-05-20
- 发明人: Takuma, Keisuke , Tajima, Takuo , Shindo, Yoshiyuki , Suzuki, Koutaro , Urakami, Tatsuhiro , Otsuji, Atsuo , Tanaka, Kouzou
- 申请人： Mitsui Chemicals, Inc.
- 申请人地址： 2-5, Kasumigaseki 3-chome, Chiyoda-ku Tokyo 100-6070 JP
- 专利权人： Mitsui Chemicals, Inc.
- 当前专利权人： Mitsui Chemicals, Inc.
- 当前专利权人地址： 2-5, Kasumigaseki 3-chome, Chiyoda-ku Tokyo 100-6070 JP
- 代理机构： Stuart, Ian Alexander
- 优先权： JP302089/96 19961113; JP93620/97 19970411; JP100211/97 19970417; JP115559/97 19970506
- 主分类号： C08G81/00
- IPC分类号： C08G81/00 ; B32B5/26 ; H01B3/30
摘要：
A polymaleimide resin composition is herein disclosed which comprises an aromatic amino resin (1), a polymaleimide resin (2) and a bifunctional crosslinking agent as components. The bifunctional crosslinking agent is preferably selected from an aliphatic diamine compound, a 2,4-diamino-S-triazine compound, a diisocyanate compound, and an aliphatic diamine compound plus a bismaleimide compound. A laminate plate for a semiconductor substrate in which the polymaleimide resin composition is used is also disclosed.
According to the present invention, there can be provided a thermosetting resin composition which permits the preparation of prepregs and green sheets having excellent flexibility, so that the workability and the productivity of the laminate plates can remarkably be improved.
According to the present invention, there can be provided a thermosetting resin composition which permits the preparation of prepregs and green sheets having excellent flexibility, so that the workability and the productivity of the laminate plates can remarkably be improved.
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