- 专利标题： Thermosetting resin composition
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申请号： EP98105988.4申请日： 1998-04-01
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公开(公告)号： EP0869151A3公开(公告)日： 1998-11-18
- 发明人: Sakamoto, Michie , Mochizuki, Amane , Yoshioka, Masahiro , Hotta, Yuji
- 申请人： NITTO DENKO CORPORATION
- 申请人地址： 1-2, Shimohozumi 1-chome Ibaraki-shi Osaka JP
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： 1-2, Shimohozumi 1-chome Ibaraki-shi Osaka JP
- 代理机构： Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权： JP102766/97 19970404
- 主分类号： C08L79/08
- IPC分类号： C08L79/08 ; C09J179/00
摘要：
A thermosetting resin composition for a fixing treatment of electronic parts, which is able to adhere in short time at low temperature, has a heat resistance, is lowly hygroscopic, and hardly produces package cracks, etc. The thermosetting resin composition comprises polycarbodiimide which is soluble in organic solvents and silicone-modified polyimide which is soluble in organic solvents, which are compounded.
公开/授权文献
- EP0869151B1 Thermosetting resin composition 公开/授权日：2004-02-18
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