发明公开
- 专利标题： Sheet removing apparatus and method
- 专利标题（中）： Abdeckfolientnahmevorrichtung和程序
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申请号： EP98110700.6申请日： 1998-06-10
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公开(公告)号： EP0886299A3公开(公告)日： 2003-09-10
- 发明人: Tsujimoto, Masaki , Saito, Hiroshi , Okamoto, Koji , Kobayashi, Kenji , Kurita, Tsuyoshi
- 申请人： LINTEC Corporation
- 申请人地址： 23-23, Honcho, Itabashi-ku Tokyo JP
- 专利权人： LINTEC Corporation
- 当前专利权人： LINTEC Corporation
- 当前专利权人地址： 23-23, Honcho, Itabashi-ku Tokyo JP
- 代理机构： Schmitz, Hans-Werner, Dipl.-Ing.
- 优先权： JP18066997 19970620; JP34189597 19971128
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
In an apparatus and method of using an adhesive tape to remove a protecting sheet applied to a semiconductor wafer, a heat-sensitive adhesive tape is thermocompressively bonded by a heat tool to an edge portion of the protecting sheet, after which a cutting blade cuts the adhesive sheet to a prescribed length, and then a tape peeling head grasps the cut adhesive tape and moves in a direction to pull the adhesive tape so as to remove the protecting sheet of the semiconductor wafer, with the removed sheet then being disposed of together with the adhesive tape into a disposal box.
公开/授权文献
- EP0886299B1 Sheet removing apparatus and method 公开/授权日：2006-01-18
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