A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 µm and whose specific surface area ranges from 0.05 to 1.5m 2 /g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol% of the epoxy group, and the epoxy equivalent ranges from 100 to 350g/eq. The conductive paste for filling via-holes and a printed circuit board comprising thereof can be used to provide an inner-via-hole connection between electrode layers without using a through-hole plating technique.