发明公开
- 专利标题： Circuit board and method of manufacturing the same
- 专利标题（中）： 电路板及其制造方法
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申请号： EP99108632.3申请日： 1999-05-12
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公开(公告)号： EP0961533A3公开(公告)日： 2001-04-11
- 发明人: Andou, Daizou , Sugawa, Toshio , Nakamura, Tadashi , Higashitani, Hideki , Tsukamoto, Masahide
- 申请人： Matsushita Electric Industrial Co., Ltd.
- 申请人地址： 1006-banchi, Oaza-Kadoma Kadoma-shi, Osaka-fu, 571-8501 JP
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： 1006-banchi, Oaza-Kadoma Kadoma-shi, Osaka-fu, 571-8501 JP
- 代理机构： VOSSIUS & PARTNER
- 优先权： JP13173198 19980514; JP15958698 19980608; JP16814398 19980616
- 主分类号： H05K3/40
- IPC分类号： H05K3/40 ; H05K3/20 ; H05K3/46
摘要：
Through holes (104) formed in an electrical insulating substrate (102) having adhesive layers (101) on its both surfaces are filled with a conductor (105). Then, supporting bases (106) having wiring layers (107) with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate (102), which are then heated and pressurized. After that, the supporting bases (106) are removed, thus obtaining a circuit board in which the wiring layers (107) have been embedded in the adhesive layers (101). The conductor (105) within the through holes (104) are compressed sufficiently, thus forming minute via holes with high reliability.
公开/授权文献
- EP0961533B1 Circuit board and method of manufacturing the same 公开/授权日：2006-05-10
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