The invention is related to an automatic soldering correction apparatus having first memory means (86) in which correction condition information necessary for correcting faulty soldered location is stored in advance for each classification of parts and second memory means (84) in which mounted parts on a board on which parts are mounted are stored. Means (81, 82, 83) are included for correlating the parts with part classifications to which the parts belong, as well as means (81) for reading correction condition information suited to a mounted part on the board from said first memory means in accordance with the correlation by said correlating means, and creating a correction-condition information table (87) in which the parts and correction condition information corresponding thereto are correlated. A corresponding method for automatic soldering correction is disclosed.