发明公开
- 专利标题： APPARATUS AND METHODS FOR CONTROLLING WORKPIECE SURFACE EXPOSURE TO PROCESSING LIQUIDS DURING THE FABRICATION OF MICROELECTRONIC COMPONENTS
- 专利标题（中）： 设备及方法处理液体OVER微电子元件的生产工件的表面撞击
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申请号： EP98950863.5申请日： 1998-09-30
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公开(公告)号： EP1029342A1公开(公告)日： 2000-08-23
- 发明人: BATZ, Robert, W., Jr. , BLACKBURN, Reed, A. , KELLY, Steven, E. , DOOLITTLE, James, W.
- 申请人： SEMITOOL, INC.
- 申请人地址： 655 West Reserve Drive Kalispell,Montana 59901 US
- 专利权人： SEMITOOL, INC.
- 当前专利权人： SEMITOOL, INC.
- 当前专利权人地址： 655 West Reserve Drive Kalispell,Montana 59901 US
- 代理机构： Hitchcock, Esmond Antony
- 优先权： US940517 19970930; US940523 19970930
- 国际公布： WO9917344 19990408
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; C25D21/12
摘要：
An apparatus (10) for use in processing a workpiece (W) to fabricate a microelectronic component is set forth. The apparatus comprises a process container (14) having a process fluid (38) therein for processing the workpiece and a workpiece holder (16) configured to hold the workpiece. A position sensor is employed to provide position information indicative of the spacing between a surface (S1) of the workpiece and a surface (39) of the process fluid. A drive system provides relative movement between the surface of the workpiece and the surface of the process fluid in response to the position information. Preferably, the relative movement provided by the drive system comprises a first motion that causes the surface of the workpiece to contact the surface of the process fluid, and a second motion opposite the direction all of and following the first to generate and maintain a column of process fluid between the surface of the process fluid and the surface of the workpiece. In one embodiment, the apparatus is configured to electroplate a material onto the surface of the workpiece.
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