A process for producing an electrodeposited copper foil, comprising electrodepositing a copper foil from an electrolyte containing copper sulfate dissolved therein, in which said electrolyte contains a small amount of lead (Pb) ions, which comprises adding a salt of a metal of Group IIA of the periodic table to the electrolyte in an amount of 10 to 150 mol per mol of lead (Pb) ions contained in the electrolyte so that the lead (Pb) ions contained in the electrolyte react with the metal of Group IIA of the periodic table to thereby form an insoluble composite substance to precipitate, said insoluble composite substance followed by removing it from the electrolyte and forming an electrodeposited copper foil in the electrolyte having the lead (Pb) ions removed therefrom. The invention further provides an electrodeposited copper foil produced by the above process, a copper-clad laminate comprising an insulating substrate having at least one side thereof laminated with this electrodeposited copper foil, and a printed wiring board having desirable wiring pattern formed from the electrodeposited copper foil of the copper-clad laminate.