发明公开
EP1167583A2 Copper-plating liquid, plating method and plating apparatus
审中-公开
Kupferplattierungsflüssigkeit，Plattierungsverfahren und Plattierungsvorrichtung
- 专利标题： Copper-plating liquid, plating method and plating apparatus
- 专利标题（中）： Kupferplattierungsflüssigkeit，Plattierungsverfahren und Plattierungsvorrichtung
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申请号： EP01116035.5申请日： 2001-07-02
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公开(公告)号： EP1167583A2公开(公告)日： 2002-01-02
- 发明人: Nagai, Mizuki , Okuyama, Shuichi , Kimizuka, Ryoichi , Kobayashi, Takeshi
- 申请人： EBARA CORPORATION
- 申请人地址： 11-1, Haneda Asahi-cho Ohta-ku, Tokyo JP
- 专利权人： EBARA CORPORATION
- 当前专利权人： EBARA CORPORATION
- 当前专利权人地址： 11-1, Haneda Asahi-cho Ohta-ku, Tokyo JP
- 代理机构： Wagner, Karl H., Dipl.-Ing.
- 优先权： JP2000199924 20000630
- 主分类号： C25D3/38
- IPC分类号： C25D3/38 ; C25D5/10 ; C25D17/00
摘要：
There is provided a copper-plating liquid free from an alkali metal and a cyanide which, when used in plating of a substrate having an outer seed layer and fine recesses of a high aspect ratio, can reinforce the thin portion of the seed layer and can embed copper completely into the depth of the fine recesses.
The plating liquid contains divalent copper ions and a complexing agent, and an optional pH adjusting agent.
The plating liquid contains divalent copper ions and a complexing agent, and an optional pH adjusting agent.
公开/授权文献
- EP1167583A3 Copper-plating liquid, plating method and plating apparatus 公开/授权日：2006-05-17
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