发明公开
EP1174455A1 Epoxy resin composition for encapsulating semiconductor
有权
Epoxyharzzusammensetzung zum Verkapseln von Halbleitern
- 专利标题： Epoxy resin composition for encapsulating semiconductor
- 专利标题（中）： Epoxyharzzusammensetzung zum Verkapseln von Halbleitern
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申请号： EP01117045.3申请日： 2001-07-12
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公开(公告)号： EP1174455A1公开(公告)日： 2002-01-23
- 发明人: Endo, Kazuhisa , Nakajima, Nobuyuki , Saito, Noriaki
- 申请人： Sumitomo Chemical Company, Limited
- 申请人地址： 5-33, Kitahama 4-chome Chuo-ku Osaka 541-8550 JP
- 专利权人： Sumitomo Chemical Company, Limited
- 当前专利权人： Sumitomo Chemical Company, Limited
- 当前专利权人地址： 5-33, Kitahama 4-chome Chuo-ku Osaka 541-8550 JP
- 代理机构： Henkel, Feiler, Hänzel
- 优先权： JP2000218860 20000719
- 主分类号： C08G59/08
- IPC分类号： C08G59/08 ; C08G59/62 ; H01L23/28 ; H01L23/29
摘要：
Provided is an epoxy resin composition having low moisture absorption and excellent solder-crack resistance for encapsulating semiconductor comprising:
(A) an epoxy resin represented by formula (1)
(B) a curing agent having a phenolic hydroxyl group, and
(C) inorganic filler in an amount of 60 to 98% by weight based on the whole composition, and the epoxy resin composition is preferably used for a resin-encapsulated type semiconductor apparatus.
(A) an epoxy resin represented by formula (1)
(B) a curing agent having a phenolic hydroxyl group, and
(C) inorganic filler in an amount of 60 to 98% by weight based on the whole composition, and the epoxy resin composition is preferably used for a resin-encapsulated type semiconductor apparatus.
公开/授权文献
- EP1174455B1 Epoxy resin composition for encapsulating semiconductor 公开/授权日：2004-09-29
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