A method and apparatus for manufacturing a multiplayer printed wiring board where the variation in the plate thickness and misregistration are eliminated by eliminating resin flow. The method for manufacturing a multiplayer printed wiring board by stacking a conductive foil or a conductor clad laminate sheet for the outer layer, a prepreg (5), and a conductor clad laminate sheet for the inner layer and then curing the prepreg (5) by hot press is characterized in that impurities are removed from the surface of the conductive foil or the conductor clad laminate sheet for outer layer, the prepreg (5), and the conductor clad laminate sheet for the inner layer by blowing gas (13) thereto before the hot press.