An edge banding apparatus (21) for adhesively securing banding material (28) to an edge of a board (27). The apparatus (21) includes a board support structure (22) formed to support a board (26) in a near vertical orientation with the edge (27) to be banded in a downwardly facing orientation. An adhesive applying assembly (23) is positioned relative to the board support structure (22) and is formed to apply adhesive (54) to the downwardly facing edge (27) during relative motion between the board (26) and the adhesive applying assembly (23). The apparatus (21) includes a banding material applying assembly (24) positioned downstream of the adhesive applying assembly (23) and formed to apply a banding material (28) to the edge after the adhesive (54) is applied and a cutoff assembly (25) which cuts off the banding material (28) as the banded board (26) passes the cutoff device (25). Pneumatic adhesive level sensing assembly (71) and a pneumatic adhesive refilling assembly are both disclosed, as is a method of edge banding a board (26).