发明公开
EP1233663A2 Via fill compositions for direct attach of devices and methods for applying same
失效
组合物用于通过对它们的使用的设备和方法的直接附接孔中填充
- 专利标题： Via fill compositions for direct attach of devices and methods for applying same
- 专利标题（中）： 组合物用于通过对它们的使用的设备和方法的直接附接孔中填充
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申请号： EP02009112.0申请日： 1994-10-28
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公开(公告)号： EP1233663A2公开(公告)日： 2002-08-21
- 发明人: Arldt, Roy Lynn , Boyko, Christina Marie , Cayson, Burtan Joe , Kozlowski, Richard Michael , Kulesza, Joseph Duane , Lauffer, John Matthew , Liu, Philip Chihchau , Markovich, Voya Rista , Mahmoud, Issa Said , Muska, James Francis , Papathomas, Kostas , Sabia, Joseph Gene
- 申请人： International Business Machines Corporation
- 申请人地址： New Orchard Road Armonk, NY 10504 US
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： New Orchard Road Armonk, NY 10504 US
- 代理机构： Teufel, Fritz, Dipl.-Phys.
- 优先权： US154341 19931117
- 主分类号： H05K3/40
- IPC分类号： H05K3/40 ; H05K1/16
摘要：
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with a cycloaliphatic epoxy fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the interconnection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
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