The present invention provides a method of bonding an adherend to a substrate which comprises applying a curable composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated hydrocarbon polymer, (C) a copolymer of which molecular chain is substantially made of one or more alkyl acrylate monomer unit(s) and/or alkyl methacrylate monomer unit(s) and (D) an epoxy resin and having a viscosity before curing of not lower than 10,000 Pa.s as determined on a B8U type viscometer under the following condition; rotor No. 7; number of revolutions 0.5 rpm; in an atmosphere at 23 DEG C, according to JIS K 7117 to the adherend and/or substrate and then joining the adherend and the substrate together without temporary tacking. By using a moisture-curable adhesive composition having a specific composition and a specific viscosity, it becomes possible to bond adherends without open time and without temporary tacking after application.