发明公开
- 专利标题： Wire bonding surface
- 专利标题（中）： Drahtbondoberfläche
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申请号： EP02252743.6申请日： 2002-04-18
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公开(公告)号： EP1296375A3公开(公告)日： 2004-04-21
- 发明人: Ciurzynski, David R. , Grubb, Kenneth L.
- 申请人： WILSON GREATBATCH LTD.
- 申请人地址： 10,000 Wehrle Drive Clarence New York 14031 US
- 专利权人： WILSON GREATBATCH LTD.
- 当前专利权人： WILSON GREATBATCH LTD.
- 当前专利权人地址： 10,000 Wehrle Drive Clarence New York 14031 US
- 代理机构： Colmer, Stephen Gary
- 优先权： US939351 20010824
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H05K3/30 ; H05K3/40 ; A61N1/375
摘要：
A bonding pad for connecting an electrical energy storage device to an implantable medical device, is described. The bonding pad comprises at least two contact surfaces, one have a channel for receiving the terminal lead of the electrical energy storage device, the other being relatively planar for contact to the medical device. That way, the channel provides for increased surface area contact with the terminal lead for a more robust connection while the opposite, planar contact surface provides flexibility for contact to a lead of the medical device.
公开/授权文献
- EP1296375A2 Wire bonding surface 公开/授权日：2003-03-26
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