The cost and complexity of an electronic pressure sensitive transducer (20) are decreased by constructing such a transducer directly on a printed circuit board (22) containing support electronics. Conductive traces (24) are formed on the printed circuit board (22) to define a contact area (26). A flexible substrate (28) having an inner surface is positioned over the contact area (26). An adhesive spacer (34), substantially surrounding the contact area (26), attaches the flexible substrate to the printed circuit board (22). At least one resistive layer (32) is deposited on the flexible substrate (28) inner surface. In use, the resistive layer (32) contacts at least two conductive traces (24) in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.