发明公开
- 专利标题： Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method
- 专利标题（中）： 环氧聚硅氧烷乳胶
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申请号： EP03256305.8申请日： 2003-10-07
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公开(公告)号： EP1408087A1公开(公告)日： 2004-04-14
- 发明人: Gorczyca, Thomas Bert
- 申请人： GENERAL ELECTRIC COMPANY
- 申请人地址： 1 River Road Schenectady, NY 12345 US
- 专利权人： GENERAL ELECTRIC COMPANY
- 当前专利权人： GENERAL ELECTRIC COMPANY
- 当前专利权人地址： 1 River Road Schenectady, NY 12345 US
- 代理机构： Pedder, James Cuthbert
- 优先权： US265422 20021007
- 主分类号： C08L83/04
- IPC分类号： C08L83/04 ; H01L33/00 ; C08G59/42
摘要：
Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising a composition of the invention. A method of encapsulating a solid state device is also provided.
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