The invention relates to a method for the production of material-treated substrates, in which: a) at least one substrate is introduced into an evacuated vacuum chamber, b) the surface of the substrate to be treated is treated with a reactive gas which is adsorbed on the surface, c) the exposure of the surface to reactive gas is ended, d) the reactive gas adsorbed on the surface is reacted, characterised in that d1) the surface with the adsorbed gas is exposed to a low-energy plasma discharge with ion energy EIO at the substrate surface of O eV