The object is to provide a photosensitive resin which is improved in the environmental problem or working environment problem, reduced in the load on a production apparatus and enhanced in the safety during transportation or storage while maintaining the resolution, etching resistance and low cost of conventional liquid photosensitive resin compositions. Another object is to provide a production process of a printed wiring board, where the non-uniformity of film thickness or liquid dripping at the time of coating a photosensitive resin on a printed board by a dipping method is reduced and high quality and excellent productivity are ensured. The objects were achieved by using a photosensitive resin composition comprising a specific compound having two or more polymerizable unsaturated bonds within one molecule, a photopolymerization initiator, water, and a thixotropic agent, and, if necessary, an amine.