发明公开
- 专利标题： PROCESS FOR INJECTION MOLDING SEMI-SOLID ALLOYS
- 专利标题（中）： 模制工艺半固体状态
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申请号： EP03720051.6申请日： 2003-05-05
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公开(公告)号： EP1515814A1公开(公告)日： 2005-03-23
- 发明人: CZERWINSKI, Frank , KADAK, Damir
- 申请人： HUSKY INJECTION MOLDING SYSTEMS LTD.
- 申请人地址： 500 Queen Street South BoltonOntario L7E 5S5 CA
- 专利权人： HUSKY INJECTION MOLDING SYSTEMS LTD.
- 当前专利权人： HUSKY INJECTION MOLDING SYSTEMS LTD.
- 当前专利权人地址： 500 Queen Street South BoltonOntario L7E 5S5 CA
- 代理机构： Dearling, Bruce Clive
- 优先权： US167478 20020613
- 国际公布： WO2003106075 20031224
- 主分类号： B22D17/00
- IPC分类号： B22D17/00 ; C22C1/00
摘要：
A injection molding process injects a semi-solid slurry with a solids content ranging from approximately 60% to 85% into a mold at a velocity sufficient to completely fill the mold. The slurry is injected under laminar or turbulent flow conditions and produces a molded article that has a low internal porosity.
公开/授权文献
- EP1515814B1 PROCESS FOR INJECTION MOLDING SEMI-SOLID ALLOYS 公开/授权日：2008-03-05
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