An impedance-matching electrical connection system (400), for use with high-frequency communication signals, includes a circuit board and a plurality of contact pads (404-4, 404-2) mounted on the circuit board. The contact pads are for coupling with a plurality of complementary connectors of an external electrical device. Each coupling is associated with an excess shunt capacitance. The electrical connection system further includes a plurality of inductive traces (408-n) mounted on the circuit board, each of which is connected to a respective contact pad, and is associated with a compensating series inductance. Additionally, the electrical connection system includes a plurality of signal lines (406-1) mounted on the circuit board, each of which is connected to a respective inductive trace. Each inductive trace is configured so that its associated compensating series inductance substantially offsets the excess shunt capacitance associated with the coupling between the contact pad connected to the inductive trace and a complementary connector.