发明公开
- 专利标题: Semiconductor device and manufacturing method thereof
- 专利标题(中): 半导体装置及它们的制备方法
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申请号: EP04022463.6申请日: 2004-09-21
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公开(公告)号: EP1519419A3公开(公告)日: 2010-01-13
- 发明人: Hayashi, Tetsuya , Tanaka, Hideaki , Hoshi, Masakatsu , Kaneko, Saichirou
- 申请人: NISSAN MOTOR CO., LTD.
- 申请人地址: 2 Takara-cho, Kanagawa-ku Yokohama-shi Kanagawa-ken JP
- 专利权人: NISSAN MOTOR CO., LTD.
- 当前专利权人: NISSAN MOTOR CO., LTD.
- 当前专利权人地址: 2 Takara-cho, Kanagawa-ku Yokohama-shi Kanagawa-ken JP
- 代理机构: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权: JP2003331246 20030924; JP2003331262 20030924; JP2004065468 20040309; JP2004065958 20040309
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/267 ; H01L29/24 ; H01L21/04
摘要:
An aspect of the present invention provides a semiconductor device that includes a first conductivity type semiconductor body, a source region in contact with the semiconductor body, whose bandgap is different from that of the semiconductor body, and which forms a heterojunction with the semiconductor body, a gate insulating film in contact with a portion of junction between the source region and the semiconductor body, a gate electrode in contact with the gate insulating film, a source electrode, a low resistance region between and in contact with the source electrode and the source region, and connected ohmically with the source electrode, and a drain electrode connected ohmically with the semiconductor body.
公开/授权文献
- EP1519419B1 Semiconductor device and manufacturing method thereof 公开/授权日:2018-02-21
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