发明公开
- 专利标题： Curable compositions
- 专利标题（中）： 可固化的组合物
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申请号： EP05003460.2申请日： 1999-09-14
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公开(公告)号： EP1533328A1公开(公告)日： 2005-05-25
- 发明人: Kitano, Kenichi, Kobe Research Laboratories , Nakagawa, Yoshiki, Kobe Research Laboratories
- 申请人： KANEKA CORPORATION
- 申请人地址： 2-4, Nakanoshima 3-chome, Kita-ku Osaka-shi, Osaka 530-8288 JP
- 专利权人： KANEKA CORPORATION
- 当前专利权人： KANEKA CORPORATION
- 当前专利权人地址： 2-4, Nakanoshima 3-chome, Kita-ku Osaka-shi, Osaka 530-8288 JP
- 代理机构： Hart Davis, Jason
- 优先权： JP26019598 19980914
- 主分类号： C08G8/38
- IPC分类号： C08G8/38 ; C08L61/06 ; C08F4/40 ; C08G81/02 ; C08L57/10 ; C08F4/10 ; C08F8/00
摘要：
The present invention provides a heat-curable composition gives cured phenolic resin products having excellent flexibility.
The present invention relates to a heat-curable composition comprising
(A) a vinyl polymer having at least one phenol group at the main-chain terminus and
(B) a phenolic resin.
The present invention relates to a polymer obtainable by reacting
(A) a vinyl polymer having at least one phenol group at the main-chain terminus
with (C) an aldehyde compound,
to a heat-curable composition comprising the polymer.
The present invention relates to a heat-curable composition comprising
(A) a vinyl polymer having at least one phenol group at the main-chain terminus and
(B) a phenolic resin.
The present invention relates to a polymer obtainable by reacting
(A) a vinyl polymer having at least one phenol group at the main-chain terminus
with (C) an aldehyde compound,
to a heat-curable composition comprising the polymer.
公开/授权文献
- EP1533328B1 Curable compositions 公开/授权日：2008-01-02
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