发明公开
- 专利标题: SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME
- 专利标题(中): 半导体元件及其制造方法
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申请号: EP04724878申请日: 2004-03-31
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公开(公告)号: EP1617483A4公开(公告)日: 2008-03-05
- 发明人: OHMI TADAHIRO , TERAMOTO AKINOBU , WAKAMATSU HIDETOSHI , KOBAYASHI YASUO
- 申请人: TOKYO ELECTRON LTD , OHMI TADAHIRO
- 专利权人: TOKYO ELECTRON LTD,OHMI TADAHIRO
- 当前专利权人: TOKYO ELECTRON LTD,OHMI TADAHIRO
- 优先权: JP2003100170 2003-04-03
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/04 ; H01L21/28 ; H01L21/318 ; H01L21/336 ; H01L29/51
摘要:
A semiconductor device exhibiting good characteristics by sustaining the dielectric constant of a High-K insulating film in a high state, and a process for fabricating a semiconductor device in which the dielectric constant of the High-K insulating film can be sustained in a high state. The semiconductor device comprises a silicon substrate, a gate electrode layer, and a gate insulating film interposed between the silicon substrate and the gate electrode layer. The gate insulating film is a high dielectric constant (high-k) film produced by nitriding a mixture of a metal and silicon. Since the High-K film itself is a nitride, generation of SiO2 can be prevented.
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