发明公开
- 专利标题： In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing
- 专利标题（中）： 化学机械抛光的原位终点检测和过程监测方法和设备
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申请号： EP05077315.9申请日： 2001-05-18
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公开(公告)号： EP1618991A1公开(公告)日： 2006-01-25
- 发明人: Hanawa, Hiroji , Johansson, Nils , Swedek, Boguslaw A. , Birang, Manoocher , Redeker, Fritz C. , Bajaj, Rajeev
- 申请人： APPLIED MATERIALS, INC.
- 申请人地址： 3050 Bowers Avenue Santa Clara, California 95054 US
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： 3050 Bowers Avenue Santa Clara, California 95054 US
- 代理机构： Bayliss, Geoffrey Cyril
- 优先权： US574008 20000519; US217228P 20000710; US221668P 20000727
- 主分类号： B24B37/04
- IPC分类号： B24B37/04 ; B24B49/02 ; B24B49/12
摘要：
A chemical mechanical polishing apparatus has a polishing pad (30), a carrier (70) to hold a substrate (10) against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad (30) and carrier head (70) for generating relative motion therebetween. An eddy current monitoring system (40) is positioned to generate an alternating magnetic field in proximity to the substrate (10), an optical monitoring system (140) generates a light beam and detects reflections of the light beam from the substrate (10), and a controller (90) receives signals from the eddy current monitoring system (40) and the optical monitoring system (140).
公开/授权文献
- EP1618991B1 POLISHING PAD 公开/授权日：2008-01-09
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