发明公开
- 专利标题： DEPOSITION AND PATTERNING PROCESS
- 专利标题（中）： 沉积和构图工艺
-
申请号： EP04809486.6申请日： 2004-07-09
-
公开(公告)号： EP1663513A2公开(公告)日： 2006-06-07
- 发明人: LEWIS, B. G. , SINGH, B. , DETIG, Robert, H. , MINOGUE, Gerard , EBERLEIN, Dietmar C. , REILLY, K. , MARCZI, M.
- 申请人： Fry's Metals Inc.
- 申请人地址： 600 Route 440 Jersey City, NJ 07304 US
- 专利权人： Fry's Metals Inc.
- 当前专利权人： Fry's Metals Inc.
- 当前专利权人地址： 600 Route 440 Jersey City, NJ 07304 US
- 代理机构： Setna, Rohan P.
- 优先权： US485912P 20030709
- 国际公布： WO2005033352 20050414
- 主分类号： B05D1/06
- IPC分类号： B05D1/06
摘要：
A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.
信息查询
