A multi-beam feed assembly having a feed assembly housing with a plurality of input waveguide(s) formed in a front face. The housing may be adapted for manufacture via die casting. The housing also having at least two PCB mounting surface(s), a plurality of probe aperture(s) through the housing between the input waveguide(s) and at least one of the PCB mounting surface(s) and at least one interconnect waveguide through the housing between two of the PCB mounting surface(s). A plurality of PCB may be coupled to the housing at the PCB mounting surfaces. A plurality of transition probe(s) located in the probe aperture(s) coupling each input waveguide to one of the plurality of the PCB and the at least one interconnect waveguide between the at least two PCB mounting surfaces coupling signals between the PCB.