发明公开
EP1711298A1 REPARATUR-LOTVERFAHREN ZUM REPARIEREN EINES BAUTEILS, WELCHES EIN BASISMATERIAL MIT EINER GERICHTETEN MIKROSTRUKTUR UMFASST
有权
用于修复组件，它具有定向显微一种碱性材料包括REPAIR焊接方法
- 专利标题： REPARATUR-LOTVERFAHREN ZUM REPARIEREN EINES BAUTEILS, WELCHES EIN BASISMATERIAL MIT EINER GERICHTETEN MIKROSTRUKTUR UMFASST
- 专利标题（英）： Process of brazing repairing of a part having a base material with oriented microstructure
- 专利标题（中）： 用于修复组件，它具有定向显微一种碱性材料包括REPAIR焊接方法
-
申请号： EP05707078.1申请日： 2005-01-28
-
公开(公告)号： EP1711298A1公开(公告)日： 2006-10-18
- 发明人: GOLDSCHMIDT, Dirk , OECHSNER, Matthias , OTT, Michael , PAUL, Uwe , PICKERT, Ursula , SCHUMANN, Eckart , SEILER, Beate , SINGER, Robert , STEINBACH, Jan , VOLEK, Andreas , VOSBERG, Volker Richard
- 申请人： SIEMENS AKTIENGESELLSCHAFT , MTU Aero Engines GmbH
- 申请人地址： Wittelsbacherplatz 2 80333 München DE
- 专利权人： SIEMENS AKTIENGESELLSCHAFT,MTU Aero Engines GmbH
- 当前专利权人： SIEMENS AKTIENGESELLSCHAFT,MTU Aero Engines GmbH
- 当前专利权人地址： Wittelsbacherplatz 2 80333 München DE
- 优先权： EP04002332 20040203
- 国际公布： WO2005075136 20050818
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K1/002 ; B23K1/005 ; F01D5/00 ; B23P6/00
摘要：
The invention relates to a method for repairing components (1) comprising a base material with an oriented microstructure, wherein the repair point (3) comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder (7) is applied in the region of a point (3) which is to be repaired and is soldered to the component (1) by means of a heating effect produced by a device (9). A temperature gradient, i.e, approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point (3) which is to be repaired.
公开/授权文献
信息查询
IPC分类:
