Enclosed (or at least substantially enclosed) microswitch cavities (114, 144, 174, 550) can be constructed with suitable channels (112, 142, 172, 540), and in some instances vents (146, 176, 525, 532, 552), to allow for the transport of fluidic microswitch components (200) to the cavities. This generally allows for fluid transport to cavities that are largely completed. Various techniques, including formation of pressure gradients and electrowetting, can be used to transport fluid along the channels. Additionally, structures and techniques for providing fluid to multiple microswitches and for providing fluid in desired amounts to microswitches are disclosed.