发明公开
- 专利标题: Hierarchical materials
- 专利标题(中): 层次分析
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申请号: EP05253591.1申请日: 2005-06-10
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公开(公告)号: EP1731492A1公开(公告)日: 2006-12-13
- 发明人: Manoharan, Mohan , Sarrafi-Nour, Reza , Minnear, William Paul , Luthra, Krishan Lal
- 申请人: GENERAL ELECTRIC COMPANY
- 申请人地址: 1 River Road Schenectady, NY 12345 US
- 专利权人: GENERAL ELECTRIC COMPANY
- 当前专利权人: GENERAL ELECTRIC COMPANY
- 当前专利权人地址: 1 River Road Schenectady, NY 12345 US
- 代理机构: Pedder, James Cuthbert
- 主分类号: C04B35/00
- IPC分类号: C04B35/00
摘要:
A material and an article comprising the material are disclosed. The material comprises a plurality of structural components (100). The structural components (100) are configured in a series of increasing structural component size classes. The series has a base unit size class (102) and at least one modular size class (104), and a component of the at least one modular size class (104) comprises a plurality of components of the next smaller size class in the series. The structural components of the base unit size class (102) comprise at least one bulk phase (103), and the structural components (100) are bonded together at interfaces (112). Mechanical damage originating within a modular size class structural component (104) is energetically favored to propagate in a distributed fashion among the plurality of structural components contained within the modular size class structural component (104).
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