To provide a cover tape capable of sufficiently suppressing corrosion of metal portions of electronic components even when the electronic components are stored in a high temperature high humidity environment for a long period of time, and a carrier tape system for packaging electronic components, whereby when the cover tape is peeled, a proper peeling strength can be constantly obtained. A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 µm, and has an antistatic agent applied thereon to form an antistatic layer.