发明公开
EP1741640A4 COVER TAPE, AND CARRIER TAPE SYSTEM FOR PACKING ELECTRONIC COMPONENT
有权
甲板带和支撑带系统用于包装电子元件
- 专利标题: COVER TAPE, AND CARRIER TAPE SYSTEM FOR PACKING ELECTRONIC COMPONENT
- 专利标题(中): 甲板带和支撑带系统用于包装电子元件
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申请号: EP05734720申请日: 2005-04-25
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公开(公告)号: EP1741640A4公开(公告)日: 2008-07-23
- 发明人: ONO TAKESHI , HIGANO MASANORI , ISHII MASANORI , IWASAKI TAKAYUKI
- 申请人: DENKI KAGAKU KOGYO KK
- 专利权人: DENKI KAGAKU KOGYO KK
- 当前专利权人: DENKI KAGAKU KOGYO KK
- 优先权: JP2004129131 2004-04-26; JP2004185262 2004-06-23; JP2004307675 2004-10-22
- 主分类号: B65D73/02
- IPC分类号: B65D73/02 ; B32B7/02 ; B32B27/00 ; B32B27/18 ; B65D85/86
摘要:
To provide a cover tape capable of sufficiently suppressing corrosion of metal portions of electronic components even when the electronic components are stored in a high temperature high humidity environment for a long period of time, and a carrier tape system for packaging electronic components, whereby when the cover tape is peeled, a proper peeling strength can be constantly obtained. A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 µm, and has an antistatic agent applied thereon to form an antistatic layer.
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