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发明公开
EP1742260A2 Controlling lateral distribution of air gaps in interconnects 审中-公开
在Interkonnekts的Vont Luftspalten

Controlling lateral distribution of air gaps in interconnects
摘要：
The invention relates to using properties of a hard mask liner against the diffusion of a removal agent to prevent air cavities formation in specific areas of an interconnect stack. The inventive method includes defining a portion on a surface of an IC interconnect stack as being specific to air cavity introduction where the defined portion is smaller than the surface of the substrate; producing at least one metal track within the interconnect stack and depositing at least one interconnect layer having a sacrificial material and a permeable material within the interconnect stack; defining at least one trench area surrounding the defined portion and forming at least one trench; depositing a hard mask layer to coat the trench; and forming at least one air cavity below the defined portion of the surface by using a removal agent for removing the sacrificial material to which the permanent material is resistant to.
摘要（中）：

本发明涉及使用硬掩模衬垫（26）抵抗去除剂的扩散来防止在互连叠层的特定区域中形成空腔的性质。 本发明的方法包括在IC互连堆叠的表面上限定特定于空气引入的部分（14），其中限定部分小于衬底的表面; 在所述互连堆叠内产生至少一个金属轨道，并且在所述互连堆叠内沉积具有牺牲材料（18）和可渗透材料（22）的至少一个互连层; 限定围绕限定部分的至少一个沟槽区域（34）并形成至少一个沟槽; 沉积硬掩模层（26）以涂覆沟槽; 以及通过使用去除所述永久材料耐受的牺牲材料的去除剂，在所述表面的限定部分下方形成至少一个空气腔（32）。

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