发明公开
EP1787335A1 LED WITH SUBSTRATE MODIFICATIONS FOR ENHANCED LIGHT EXTRACTION AND METHOD OF MAKING SAME 有权
与底物LED的修改,以增加生产该光提取和过程

  • 专利标题: LED WITH SUBSTRATE MODIFICATIONS FOR ENHANCED LIGHT EXTRACTION AND METHOD OF MAKING SAME
  • 专利标题(中): 与底物LED的修改,以增加生产该光提取和过程
  • 申请号: EP05761972.8
    申请日: 2005-06-09
  • 公开(公告)号: EP1787335A1
    公开(公告)日: 2007-05-23
  • 发明人: BATRES, MaxIBBETSON, JamesLI, TingSAXLER, Adam, W.
  • 申请人: CREE, INC.
  • 申请人地址: 4600 Silicon Drive Durham, NC 27703 US
  • 专利权人: CREE, INC.
  • 当前专利权人: CREE, INC.
  • 当前专利权人地址: 4600 Silicon Drive Durham, NC 27703 US
  • 代理机构: South, Nicholas Geoffrey
  • 优先权: US585326P 20040702; US83460 20050317
  • 国际公布: WO2006016955 20060216
  • 主分类号: H01L33/00
  • IPC分类号: H01L33/00
LED WITH SUBSTRATE MODIFICATIONS FOR ENHANCED LIGHT EXTRACTION AND METHOD OF MAKING SAME
摘要:
The surface morphology of an LED light emitting surface is changed by applying a reactive ion etch (RIE) process to the light emitting surface. Etched features, such as truncated pyramids, may be formed on the emitting surface, prior to the RIE process, by cutting into the surface using a saw blade or a masked etching technique. Sidewall cuts may also be made in the emitting surface prior to the RIE process. A light absorbing damaged layer of material associated with saw cutting is removed by the RIE process. The surface morphology created by the RIE process may be emulated using different, various combinations of non-RIE processes such as grit sanding and deposition of a roughened layer of material or particles followed by dry etching.
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