A method of manufacturing an optical device includes the steps of: forming a first multilayer film, including forming a first mirror (102) above a substrate (101), forming an active layer (103) above the first mirror (102), forming a second mirror (104) above the active layer (103), forming a semiconductor layer (122) on the second mirror (104), and forming a sacrificial layer on the semiconductor layer (122); conducting a first examination step of conducting a reflectance examination on the first multilayer film; forming a second multilayer film by removing the sacrificial layer from the first multilayer film; conducting a second examination step of conducting a reflectance examination on the second multilayer film; and patterning the second multilayer film to form a surface-emitting laser section (140) having the first mirror (102), the active layer (103) and the second mirror (104), and a diode section (120) having the semiconductor layer (122), wherein the sacrificial layer is formed to have an optical film thickness of an odd multiple of λ / 4, where λ is a design wavelength of light emitted by the surface-emitting laser section (140).