An organic diode device (1) comprises an organic diode structure (2) having an anode layer (12), a cathode layer (13) and an organic layer (14). One of the anode layer (12) and the cathode layer (13) has a set of contact areas (19, 20) that are distributed over a face (15) of said structure (2). A barrier layer (16) hermetically covers said structure (2) and is provided with a set of openings (23, 24) aligned with said set of contact areas (19, 20). A metal conductor (5) has been electroplated on said barrier layer (16) and contacts the set of contact areas (19, 20) via the set of openings (23, 24). A method of forming such a device comprises forming the structure (2), forming the barrier layer (16) with the set of openings (23, 24), and exposing said structure (2) to an electroplating process to form the metal conductor (5).